I was taught to use the least amount of thermal paste possible for full coverage and to spread it out evenly with something like a business card. However, I've seen numerous experts on YouTube put a blob of thermal paste in the center of the CPU and then just squish it by tightening down the cooler.

In my experience the spread out paste allows for better cooling.

Which is preferred? Did something change? Have I been wrong the entire time?

I did it the spreader way last time, used my expired concealed pistol licence. I was told putting a blob on there could leave gaps, which could cause areas to heat up, and possibly damage the CPU.

Best method is to put a small dot about the size of a BB in the center. That’s what I’ve always done and never had any problems. Makes a super thin layer.

When we replaced any component on variable frequency drives that needed thermal paste, we always used the same technique - spread it on thin with full surface coverage.

I've been out of that side of the business for a few years though, so my experience may be as dated as yours.

I'm in electronics manufacturing. Full coverage, spread thin. Carry on.

Thanks. I'll do the spread out thing.

quote:

Originally posted by vthoky:
I'm in electronics manufacturing. Full coverage, spread thin. Carry on.

This is what I did. Worked for me. Make it look neat and even as you can and let the excess squeeze out, wipe it up and rock on.

I've done both but usually spread it out.
I use Artic Silver.

quote:

Originally posted by mark123:
Which is preferred? Did something change?

What is preferred is what the manufacturer recommends. Cooler manufacturers will have a specific recommendation as to how to apply thermal paste which I religiously adhere to when working on my PC's.

I always used a razor blade and spread it as thin and even as possible.

Watched this video awhile back when wondering the same thing.

I just bought this: graphite thermal pad. I have no experience, but I know that pastes lose their thermal conductivity over time. Supposedly, this pad does not.

JP

I would think a small blob would allow for better/full contact. I would expect voids if spread, resulting in less thermal transfer.

Test and then remove to see distribution using both methods.

Caveat... I've never used the stuff.

I don’t think it matters. If it oozes out the sides, you used enough.

Tony.